Welcome!

iPhone Authors: Elizabeth White, Kevin Benedict, Yeshim Deniz, Matthew Lobas, Shelly Palmer

News Feed Item

Invensas to Showcase xFD Technology Platforms During COMPUTEX 2014

Tessera Technologies, Inc. (Nasdaq: TSRA), announced today that Invensas Corporation, its wholly owned subsidiary, will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFDTM) products during the COMPUTEX 2014 trade show in Taipei, Taiwan. The Invensas demonstration will take place at the Grand Hyatt in Suite 1040, at 2 Song Shou Road, Taipei from June 3rd to June 6th, 2014.

To be exhibited:

  • High density, high performance RDIMM: ADATA Technology, one of the world’s largest manufacturers of DRAM modules, will demonstrate its new JEDEC standard, low voltage, 32GB RDIMM enabled by Invensas xFD technology at COMPUTEX 2014 located at the Taipei World Trade Center, Nangang Exhibition Hall, Taipei, Taiwan in booth number J0606. “ADATA’s new 32GB memory module, enabled by Invensas xFD technology, offers the best combination of ultra-high density, ultra-low power and ultra-fast performance of any product in a standard JEDEC form factor RDIMM (registered dual in-line memory module) for the cloud computing and enterprise server markets,” said Ted Tsai, Director, DRAM Product Marketing, ADATA Technology. ADATA’s 32GB RDIMMs will also be displayed at the Invensas Suite in the Grand Hyatt. Invensas xFD technology decreases component size, increases product bandwidth, speed and power performance, and improves thermal output for high density server RDIMMs.
  • Thin form factor, highest density SODIMM: Buffalo Memory, a global leader of direct attached storage solutions, will display the world’s first and highest capacity, JEDEC standard, single-sided SODIMM at the Invensas Suite at the Grand Hyatt. “Buffalo’s new 8GB single-sided SODIMM, enabled by Invensas xFD technology, allows replaceable memory in an ultra-slim form factor for thin and light client computing systems requiring non-soldered down memory,” said Mr. Yasuaki Mayoi, General Manager of the Buffalo Memory Sales Division. Invensas’ double density xFD technology enables single-sided SODIMMs to reach memory capacities of larger client computing systems.

More details on Invensas’ xFD technology can be found at www.invensas.com.

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, benefits and characteristics of Invensas’ xFD technology. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the "Company"); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2013, and its Quarterly Report on Form 10-Q for the quarter ended Mar. 31, 2014, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.

About Tessera and Invensas

Tessera Technologies, Inc. and Invensas Corporation, its wholly owned subsidiary, (Nasdaq: TSRA - News), are global leaders in semiconductor interconnect solutions and intellectual property. We innovate in areas such as mobile computing and communications, memory and data storage, MEMS, LED, and 3-D Integrated Circuit (3DIC) technologies. We are headquartered in San Jose, California, and license our solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and deliver the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact our press relations at +1 408 324 5105.

Invensas, the Invensas logo, Tessera, the Tessera logo and xFD are trademarks or registered trademarks of affiliated companies of Tessera Technologies, Inc. in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

About ADATA Technology

ADATA Technology, one of the world's largest vendors of DRAM Modules and USB Flash Drives, provides complete memory solutions, including memory cards, solid state drives, and portable hard drives. ADATA products are internationally recognized by Germany's iF Design Award, red dot Award, CES Best of Innovations Award, Japan's Good Design Award, Best Choice of Computex Award, and Taiwan Excellence Gold Award. The company's slogan of Love, Life, Dreams, embodies the ADATA brand and the role of innovative memory products in the human pursuit of universally cherished ideas. For more information, please visit www.adata.com.

About Buffalo Memory

Buffalo Memory, a subsidiary of Buffalo, makes digital appliances and PC peripherals, and develops and sells semiconductor-related products such as SSDs, memory cards and memory modules for the industrial equipment industry. As an award-winning committee member for the Joint Electron Device Engineering Council (JEDEC), Buffalo is one of few manufacturers providing Gerber designs for the memory industry, which empowers Buffalo to lead the industry with future generation module designs. Experience, reputation and reliability make Buffalo products a clear choice to PC and Apple consumers, resellers, system builders and computer integrators worldwide.

TSRA-G

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.